Reliability　test　and　finite　element　analysis　have　been　conducted　to　study　the　reliability　of　PBGA　(Plastic　Ball　Grid　Array　Package)　under　random　vibration　load.　Firstly,　random　vibration　tests　with　various　levels　of　excitation　were　conducted　on　the　PBGA　PCB　(Printed　Circuit　Board)　samples;　the　resistances　of　the　components　are　monitored　on　real　time,　and　a　two-parameter　Weibull　distribution　model　was　used　to　analyze　the　test　results.　Thus,　the　failure　time　was　acquired.　Secondly,　finite　element　analysis　was　conducted　on　the　3D　model　of　the　test　samples　in　order　to　ensure　the　model　accuracy.　Frequency　and　displacement　were　measured　to　compare　the　analysis　results,　and　the　vibration　fatigue　life　was　calculated　based　on　Steinberg　model.　Lastly,　by　comparing　the　test　results　and　the　analysis　results,　Steinberg　model　is　modified　to　ensure　the　prediction　error　of　vibration　fatigue　model　of　PBGA　package　is　less　than　70%,　which　proves　the　random　vibration　fatigue　model　has　good　precision　in　engineering.　©　2020　Totem　Publishers　Ltd.　All　rights　reserved.