Laser　lift-off　(LLO)　is　a　technique　used　to　transfer　devices　to　terminal　substrates　through　the　ablation　of　materials　by　pulsed　laser　irradiation.　Recently,　LLO　has　become　the　major　technique　for　the　fabrication　of　flexible　electronic　devices　because　of　its　wide　material　applicability　and　process　compatibility.　Further,　the　representative　research　achievements　of　LLO　in　case　of　the　fabrication　of　flexible　electronics　are　investigated　and　presented　in　this　study　with　respect　to　the　basic　mechanisms　and　technological　features,　and　novel　theories　and　application　techniques　are　given　particular　emphasis.　Accordingly,　the　application　prospects　of　the　LLO　technique,　especially　the　possibility　of　ultrafast　laser　applications,　are　summarized　and　forecasted.　©　2020,　Chinese　Lasers　Press.　All　right　reserved.