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作者:

Pan, Shijie (Pan, Shijie.) | Feng, Shiwei (Feng, Shiwei.) (学者:冯士维) | Li, Xuan (Li, Xuan.) | Zheng, Xiang (Zheng, Xiang.) | Lu, Xiaozhuang (Lu, Xiaozhuang.) | Hu, Chaoxu (Hu, Chaoxu.) | He, Xin (He, Xin.) | Bai, Kun (Bai, Kun.) | Zhou, Lixing (Zhou, Lixing.) | Zhang, Yamin (Zhang, Yamin.)

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摘要:

The effects of gamma irradiation on the electrical and trapping properties of AlGaN/GaN high-electron-mobility transistors (HEMTs) are investigated in detail. During the irradiation, the gate-source leakage current of the HEMT is monitored online when applying a reverse gate voltage. The variations of electrical properties of the device, including an increase in drain-source current, the negative threshold voltage shift, and a decrease of leakage current, are observed. In particular, three traps in the device are identified using the voltage-transient method and the variations of these traps after irradiation are also investigated. The results show that the absolute amplitudes of the three traps in the device decrease after irradiation, which indicates a reduction in the density of the traps. Furthermore, it is proposed that the time constants and energy levels of the three traps decrease after irradiation. The observed changes in the trapping behaviors are ascribed to the structural ordering of the defects, which is consistent with the improvement in the electrical characteristics of the device.

关键词:

gallium nitride (GaN) gamma irradiation high-electron-mobility transistors (HEMTs) trap voltage-transient method

作者机构:

  • [ 1 ] [Pan, Shijie]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 2 ] [Feng, Shiwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Xuan]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 4 ] [Zheng, Xiang]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 5 ] [Lu, Xiaozhuang]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 6 ] [Hu, Chaoxu]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 7 ] [He, Xin]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 8 ] [Bai, Kun]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 9 ] [Zhou, Lixing]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 10 ] [Zhang, Yamin]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China

通讯作者信息:

  • 冯士维

    [Feng, Shiwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China

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来源 :

SEMICONDUCTOR SCIENCE AND TECHNOLOGY

ISSN: 0268-1242

年份: 2021

期: 9

卷: 36

1 . 9 0 0

JCR@2022

ESI学科: PHYSICS;

ESI高被引阀值:7

被引次数:

WoS核心集被引频次: 5

SCOPUS被引频次: 6

ESI高被引论文在榜: 0 展开所有

万方被引频次:

中文被引频次:

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