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作者:

Zhang, H. H. (Zhang, H. H..) | Ji, X. L. (Ji, X. L..) | Han, S. Y. (Han, S. Y..) | Fan, L. F. (Fan, L. F..)

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EI Scopus SCIE

摘要:

T-stress plays an important role in the fracture of various materials, and is frequently adopted as a second fracture parameter in addition to the stress intensity factor. In this paper, the T-stresses for cracks in both homogeneous and functionally graded materials under thermal loadings are computed by the numerical manifold method (NMM), which is very suitable for crack modeling due to the use of bi-cover systems. After the calculation of temperature and displacement fields by the NMM solver, the T-stress is extracted through the domainindependent interaction integral. The proposed method is verified through two benchmark problems and then applied to study three more complex cases where the effects of material parameters and crack configurations on the T-stress are further examined.

关键词:

materials T-stress Thermal cracks Homogeneous and functionally graded Numerical manifold method Interaction integral

作者机构:

  • [ 1 ] [Zhang, H. H.]Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
  • [ 2 ] [Ji, X. L.]Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
  • [ 3 ] [Han, S. Y.]Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China
  • [ 4 ] [Fan, L. F.]Beijing Univ Technol, Coll Architecture & Civil Engn, Beijing 100084, Peoples R China

通讯作者信息:

  • [Han, S. Y.]Nanchang Hangkong Univ, Sch Civil Engn & Architecture, Nanchang 330063, Jiangxi, Peoples R China

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来源 :

THEORETICAL AND APPLIED FRACTURE MECHANICS

ISSN: 0167-8442

年份: 2021

卷: 113

5 . 3 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:87

JCR分区:1

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WoS核心集被引频次: 2

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