Glass　as　an　alternative　printed　circuit　board　material　and　interposer　has　been　investigated　for　use　in　the　micro-electronics　industry.　Electroless　copper　plating　is　used　to　provide　the　conductive　layer,　but　there　is　limited　understanding　of　how　the　surface　topography　of　the　glass　substrate　affects　the　copper/glass　bonding　strength　exhibited　in　the　current　literature.　A　laser　ablation　technique　was　used　to　prepare　glass　surfaces　with　micro-scale　structured　features　in　this　study,　and　these　features　were　characterized　quantitatively　using　areal　surface　texture　parameters.　The　copper/glass　bonding　adhesion　strength　was　quantified　using　a　scratch　testing　technique,　and　the　relationships　between　the　critical　loads　measured　and　the　areal　surface　parameters,　as　well　as　discussion　of　the　underlying　mechanisms,　are　presented　in　this　report.　Statistical　analysis　was　employed　to　identify　the　most　relevant　areal　parameters　that　may　be　used　for　prediction　of　the　copper/glass　bonding　strength　and　for　design　of　adhesion　promoting　surface　textures.　The　experimental　results　suggest　that　the　most　significant　areal　surface　texture　parameters　to　consider　are　Sq,　Sdq,　Sdr,　Sxp,　Vv,　Vmc,　and　Vvc,　and　the　recommended　value　range　for　each　parameter　for　optimal　plating　adhesion　performance　is　given.