Non-clean　soldering　technology　and　low　temperature　bonding　will　be　of　great　significant　for　applications　in　electronic　industry.　A　curable　solder　paste　containing　epoxy-based　flux　and　Sn-58Bi　solder　powder　was　developed.　The　solder　joint　covered　by　cured　epoxy　shell　can　be　obtained　by　soldering　process.　The　thermal-curing　process　of　the　curable　flux　was　monitored　by　DSC　to　ensure　the　wetting　and　metallurgical　connection　between　Sn-58Bi　and　Cu　substrate.　The　microstructure　characteristics　of　the　solder　joints　were　analyzed　by　metallurgical　analysis　and　SEM　observation.　The　factors　influencing　the　structure　of　the　solder　joints　were　analyzed　and　discussed.