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作者:

Jian, Yin (Jian, Yin.) | Ri, Pan (Ri, Pan.) | Fan, Jinwei (Fan, Jinwei.) (学者:范晋伟) | Wang, Zhenzhong (Wang, Zhenzhong.) | Zhang, Dongxu (Zhang, Dongxu.) | Ji, Shuting (Ji, Shuting.)

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EI Scopus SCIE

摘要:

Currently, research on the optimization of key process parameters in the polishing process usually uses orthogonal test method, which needs a lot of experiments. In order to solve this problem, this paper proposes a parameters optimization of magnetic composite fluid polishing process based on response surface method. Firstly, roughness of the polycarbonate microfluidic chip surface polished with magnetic composite fluid was used as the optimization object, while the machining gap, spindle speed and machining time were defined as the key parameters, and experiments were designed and conducted based on response surface method. Subsequently, using the above experimental data, a prediction model for microfluidic chip surface roughness after polishing that depends on key parameters is established. After that, by the application of the prediction model, the key parameters were optimized and verified by experiments. The results indicated that by using the optimized process parameters, the minimum surface roughness of the microfluidic chip reduced from 0.5 mu m to 0.0384 mu m, while the maximum and minimum errors between measured and predicted results are 0.0052 mu m and 0.0007 mu m, respectively. The above result has proved the accuracy of the established model and the effectiveness of the proposed parameters optimization method.

关键词:

Magnetic composite fluid polishing process parameter optimization surface roughness response surface method

作者机构:

  • [ 1 ] [Jian, Yin]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Ri, Pan]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Fan, Jinwei]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Ji, Shuting]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Wang, Zhenzhong]Xiamen Univ, Dept Mech & Elect Engn, Xiamen, Peoples R China
  • [ 6 ] [Zhang, Dongxu]Xiamen Univ, Dept Mech & Elect Engn, Xiamen, Peoples R China
  • [ 7 ] [Wang, Zhenzhong]Xiamen Univ, Shenzhen Res Inst, Shenzhen, Peoples R China

通讯作者信息:

  • [Ri, Pan]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China

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来源 :

JOURNAL OF THE CHINESE INSTITUTE OF ENGINEERS

ISSN: 0253-3839

年份: 2021

期: 1

卷: 45

页码: 35-41

1 . 1 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:87

JCR分区:4

被引次数:

WoS核心集被引频次: 3

SCOPUS被引频次: 2

ESI高被引论文在榜: 0 展开所有

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