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Author:

Liu, Bendong (Liu, Bendong.) | Ma, Chenxu (Ma, Chenxu.) | Yang, Jiahui (Yang, Jiahui.) | Li, Desheng (Li, Desheng.) (Scholars:李德胜) | Liu, Haibin (Liu, Haibin.) (Scholars:刘海滨)

Indexed by:

EI Scopus SCIE

Abstract:

Thermal bubble-driven micropumps have the advantages of high reliability, simple structure and simple fabrication process. However, the high temperature of the thermal bubble may damage some biological or chemical properties of the solution. In order to reduce the influence of the high temperature of the thermal bubbles on the pumped liquid, this paper proposes a kind of heat insulation micropump driven by thermal bubbles with induction heating. The thermal bubble and its chamber are designed on one side of the main pumping channel. The high temperature of the thermal bubble is insulated by the liquid in the heat insulation channel, which reduces the influence of the high temperature of the thermal bubble on the pumped liquid. Protypes of the new micropump with heat source insulation were fabricated and experiments were performed on them. The experiments showed that the temperature of the pumped liquid was less than 35 degrees C in the main pumping channel.

Keyword:

microfluidics heat source insulation thermal bubble driven induction heating micropump

Author Community:

  • [ 1 ] [Liu, Bendong]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 2 ] [Ma, Chenxu]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 3 ] [Yang, Jiahui]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 4 ] [Li, Desheng]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 5 ] [Liu, Haibin]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 6 ] [Yang, Jiahui]Beijing Vocat Coll Agr, Elect & Mech Coll, Beijing 102208, Peoples R China

Reprint Author's Address:

  • [Liu, Bendong]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China

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Related Keywords:

Source :

MICROMACHINES

Year: 2021

Issue: 9

Volume: 12

3 . 4 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:87

JCR Journal Grade:2

Cited Count:

WoS CC Cited Count: 6

SCOPUS Cited Count: 6

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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