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作者:

Dai, Yanwei (Dai, Yanwei.) (学者:代岩伟) | Qin, Fei (Qin, Fei.) | Liu, Yinghua (Liu, Yinghua.) | Chen, Haofeng (Chen, Haofeng.)

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摘要:

Interface creep cracking is very common to be seen in various kinds of welded components which are used widely in engineering practice. In the present paper, the interface creep crack tip field by considering material mismatch effect is studied. The interface creep crack is found to be close to the HRR field which can produce the faster creep crack growth rate. A material mismatch constraint parameter is proposed based on the validation of the local mismatch effect on the interface creep crack tip field which also maintains the self-similarity. An averaged material mismatch constraint M*avg is presented to represent the material mismatch constraint effect. It reveals that the material mismatch constraint effect for interface creep crack decreases with the increase of the local mismatch factor. The physical meaning of the material mismatch constraint effect for the interface creep crack and its future application to engineering failure analysis is also discussed and presented.

关键词:

Stress field Self-similarity Material constraint Material mismatch Interface creep crack

作者机构:

  • [ 1 ] [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 2 ] [Qin, Fei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 3 ] [Dai, Yanwei]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing, Peoples R China
  • [ 4 ] [Qin, Fei]Beijing Univ Technol, Beijing Key Lab Adv Mfg Technol, Beijing, Peoples R China
  • [ 5 ] [Liu, Yinghua]Tsinghua Univ, Dept Engn Mech, AML, Beijing 100084, Peoples R China
  • [ 6 ] [Chen, Haofeng]Univ Strathclyde, Dept Mech & Aerosp Engn, Glasgow City G1 1XJ, Scotland
  • [ 7 ] [Chen, Haofeng]East China Univ Sci & Technol, Sch Mech & Power Engn, Shanghai 200237, Peoples R China

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来源 :

ENGINEERING FAILURE ANALYSIS

ISSN: 1350-6307

年份: 2022

卷: 140

4 . 0

JCR@2022

4 . 0 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:49

JCR分区:1

中科院分区:2

被引次数:

WoS核心集被引频次: 2

SCOPUS被引频次: 2

ESI高被引论文在榜: 0 展开所有

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