Thermomechanical　reliability　assessment　for　sintered　silver　is　a　crucial　issue　as　sintered　silver　is　a　promising　candidate　of　die-attachment　materials　adopted　for　power　devices.　In　this　paper,　the　nano-indentation　tests　are　performed　for　sintered　silver　in　typical　die-attach　interconnection　under　different　thermal　cycles.　Based　on　thermal　cycling　test,　the　Young＇s　modulus　and　hardness　of　sintered　silver　layer　have　been　presented.　It　is　found　that　the　Young＇s　modulus　and　hardness　of　sintered　silver　layer　changes　slightly　although　the　microstructure　of　sintered　silver　also　presents　some　variations.　The　stress　and　strain　curves　for　different　thermal　cycling　tests　of　sintered　silver　are　also　given　based　on　reverse　analysis　of　nano-indentation.　The　results　show　that　the　elastoplastic　constitutive　equations　change　significantly　after　thermal　cycling　tests,　and　the　yielding　stress　decreases　remarkably　after　70　thermal　cycles.　The　experimental　investigation　also　shows　that　the　cracking　behaviors　of　sintered　silver　depend　on　its　geometry　characteristics,　which　implies　that　the　possible　optimization　of　sintered　silver　layer　could　enhance　its　thermomechanical　performance.