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作者:

Feng, Feng (Feng, Feng.) | Na, Weicong (Na, Weicong.) | Jin, Jing (Jin, Jing.) | Zhang, Jianan (Zhang, Jianan.) | Zhang, Wei (Zhang, Wei.) | Zhang, Qi-Jun (Zhang, Qi-Jun.)

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EI Scopus SCIE

摘要:

This article presents an overview of artificial neural network (ANN) techniques for a microwave computer-aided design (CAD). ANN-based techniques are becoming useful for performing forward/inverse modeling for active/passive components to enhance a circuit design. With measured or simulated data of microwave devices, ANNs can be trained to learn relevant microwave relationships, which are, otherwise, computationally expensive or for which efficient analytical formulas are not available. Fundamental concepts of the ANN structure and training, such as feedforward neural networks (FFNNs), recurrent neural networks (RNNs)/dynamic neural networks (DNNs)/time-delay neural networks (TDNNs), deep neural networks, and neural network training and extrapolation, are described. Knowledge-based neural networks (KBNNs) are described for improving the accuracy and reliability of modeling and design optimization. Various advanced ANN techniques, such as neuro-transfer function (neuro-TF) modeling, neural network inverse modeling, and deep neural network modeling, are discussed. The existing and emerging applications of ANN in microwave CAD are identified, such as electromagnetic (EM)/multiphysics modeling, modeling of nonlinear circuits and transistors, filter design, very large-scale integration (VLSI) interconnects, oscillator, transmitter and receiver modeling, and CAD applications in such as gallium nitride (GaN) high electron-mobility transistor (HEMT), wireless power transfer (WPT), microelectromechanical system (MEMS), and substrate-integrated waveguide (SIW).

关键词:

Solid modeling Integrated circuit modeling knowledge-based neural network (KBNN) deep neural network Neural networks Microwave circuits Artificial neural networks (ANNs) inverse modeling microwave computer-aided design (CAD) Microwave theory and techniques Microwave integrated circuits neuro-transfer function (neuro-TF) Deep learning

作者机构:

  • [ 1 ] [Feng, Feng]Tianjin Univ, Sch Microelect, Tianjin 300072, Peoples R China
  • [ 2 ] [Na, Weicong]Beijing Univ Technol, Fac Informat Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Jin, Jing]Cent China Normal Univ, Coll Phys Sci & Technol, Wuhan 430079, Peoples R China
  • [ 4 ] [Zhang, Jianan]Southeast Univ, State Key Lab Millimeter Waves, Nanjing 210096, Peoples R China
  • [ 5 ] [Zhang, Wei]Beijing Univ Posts & Telecommun, Sch Elect Engn, Beijing 100876, Peoples R China
  • [ 6 ] [Zhang, Qi-Jun]Carleton Univ, Dept Elect, Ottawa, ON K1S 5B6, Canada

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来源 :

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

ISSN: 0018-9480

年份: 2022

期: 11

卷: 70

页码: 4597-4619

4 . 3

JCR@2022

4 . 3 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:49

JCR分区:2

中科院分区:2

被引次数:

WoS核心集被引频次: 60

SCOPUS被引频次: 89

ESI高被引论文在榜: 0 展开所有

万方被引频次:

中文被引频次:

近30日浏览量: 6

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