This　study　obtains　W-Cu　materials　suitable　for　the　electronic　packaging　by　fabricating　W-Cu　composites　with　different　W　contents　(such　as　60W-40Cu,　70W-30Cu,　75W-25Cu,　and　80W-5Ni-15Cu)　through　selective　laser　melting.　The　effect　of　W　content　on　the　microstructure,　density,　thermal　conductivity,　coefficient　of　thermal　expansion,　roughness,　and　hardness　is　evaluated.　The　results　show　that　the　balling　phenomenon　is　common　in　such　four　composites.　When　the　W　mass　fraction　is　less　than　70%,　the　densification　mechanism　is　rearrangement;　connection　and　contiguity　are　hardly　observed　between　W　phases;　heat　conduction　is　preferred　in　the　Cu　phases.　In　addition,　when　the　W　mass　fraction　is　higher　than　75%,　solid　sintering　is　the　main　densification　mechanism,　and　the　heat　conduction　path　contains　the　constitutional　unit　of　Cu　occupying　the　unit　edges　and　W　occupying　the　unit　center.　The　deviation　between　the　thermal　conductivity/coefficient　of　thermal　expansion　of　W-Cu　composites　and　the　theoretical　values　increases　with　increasing　W　content,　which　also　occurs　in　the　cases　of　roughness　and　hardness.　The　obtained　densities　of　60W-40Cu,　70W-30Cu,　75W-25Cu,　and　80W-5Ni-15Cu　are　97.9%,　94.5%,　91.6%,　and　91.9%,　respectively.　The　thermal　conductivities　of　the　four　composites　are　210.4,　176.8,　152.7,　and　121.3　W•K-1•m-1,　respectively.　Furthermore,　the　thermal　expansion　coefficients　of　the　four　composites　are　11.05×10-6,　9.33×10-6,　8.17×10-6,　and　7.02×10-6-1,　respectively.　The　surface　roughnesses　of　the　four　composites　are　9.2,　13.7,　15.2,　and　15.4　μm,　and　the　microhardnesses　are　183,　324,　567,　and　729　HV,　respectively.　©　2019,　Chinese　Lasers　Press.　All　right　reserved.