A　six-side　molded　wafer-level　chip　scale　package　(mWLCSP)　is　a　novel　and　attractive　packaging　method　for　smart　phone　applications　due　to　its　lower　cost,　better　electrical　performance,　and　higher　long-term　reliability.　Nevertheless,　wafer　warpage　in　different　manufacturing　processes　is　a　significant　issue　for　the　six-side　mWLCSP.　This　article　focuses　on　wafer　warpage　evolution　in　different　packaging　processes　and　the　development　of　control　method　for　the　six-side　mWLCSP.　A　quarter　wafer-level　finite-element　(FE)　model　and　a　strip-level　FE　model　were　established　to　simulate　the　actual　packaging　processes　by　element　birth　and　death　method　and　restart　technology.　Both　the　FE　models　were　proved　quite　efficient　and　accurate　for　warpage　prediction　compared　to　the　experimental　results.　The　effects　of　geometric　parameters　and　material　parameters　on　the　maximum　warpage　value　were　studied　based　on　the　two　established　FE　warpage　models,　and　some　recommendations　were　given　for　warpage　optimization.　Based　on　the　above　studies,　an　improved　manufacturing　process　flow　for　the　six-side　mWLCSP　was　presented　and　proved　feasible　to　control　the　maximum　warpage　value　under　3　mm.　It　offers　an　insight　work　for　the　development　and　warpage　control　of　the　six-side　mWLCSP　and　other　wafer-level　molded　packages.