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作者:

Zheng, Xiang (Zheng, Xiang.) | Feng, Shiwei (Feng, Shiwei.) (学者:冯士维) | Gao, Yifu (Gao, Yifu.) | Zhang, Yamin (Zhang, Yamin.) | Jia, Yunpeng (Jia, Yunpeng.) | Pan, Shijie (Pan, Shijie.)

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EI Scopus

摘要:

Trapping effects in GaN HEMTs still limit their performance. The current-transient methodology has shown advantages in characterizing traps in the device. However, the voltage drift may cause errors in measurements with high accuracy requirements. In this paper, we present a methodology to characterize traps in GaN HEMTs using the voltage-transient measurements. We demonstrate the advantages of this method in terms of simplicity and effectiveness. In particular, it avoids the said problem due to the optimized measuring circuit. With this method, we have identified the time constants and energy levels of traps in the AlGaN barrier layer and the GaN buffer layer, respectively, in the devices. Their trapping and de-trapping mechanisms were also demonstrated at various temperature measurements. A classic exponential dependence of the degradation rate on the channel current was identified. © 2018 Elsevier Ltd

关键词:

Aluminum gallium nitride Buffer layers Degradation Gallium nitride High electron mobility transistors III-V semiconductors Power quality Semiconductor alloys Temperature measurement Transients

作者机构:

  • [ 1 ] [Zheng, Xiang]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Feng, Shiwei]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Gao, Yifu]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Zhang, Yamin]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Jia, Yunpeng]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [Pan, Shijie]College of Microelectronics, Beijing University of Technology, Beijing; 100124, China

通讯作者信息:

  • 冯士维

    [feng, shiwei]college of microelectronics, beijing university of technology, beijing; 100124, china

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来源 :

Microelectronics Reliability

ISSN: 0026-2714

年份: 2019

卷: 93

页码: 57-60

1 . 6 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:52

JCR分区:3

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WoS核心集被引频次: 0

SCOPUS被引频次: 12

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