To　investigate　the　process　and　thermal　physical　performance　of　W-Ni-Cu　manufactured　using　the　Selective　Laser　Melting　(SLM)　technique,　an　experiment　of　four　variables　was　conducted　to　study　the　influence　of　laser　power,　scanning　speed,　length　of　the　scanning　line,　and　overlap　rate　on　the　density.　Scanning　electron　microscopy　as　well　as　a　thermal　analyzer,　differential　scanning　calorimeter,　and　thermal-mechanical　analyzer　were　used　to　study　the　microstructure,　thermal　conductivity,　and　thermal　expansion.　The　results　show　that　the　density　of　W-Ni-Cu　reaches　94.5%　with　the　optimized　process.　The　microstructure　is　a　type　of　bridging　connection,　and　agglomeration　occurs　between　the　W　phases　and　CuNi　phase　that　wraps　around　the　W　phase　like　a　network.　When　the　measuring　direction　is　parallel　to　the　processing　direction,　the　thermal　conductivity　and　thermal　expansion　coefficients　are　120.314　0　W/m•K　and　7.16×10-6/K,　respectively.　When　the　measuring　direction　is　perpendicular　to　the　processing　direction,　the　thermal　conductivity　and　thermal　expansion　coefficients　are　99.257　2　W/m•K　and　7.02×10-6/K,　respectively.　Test　pieces　form　in　different　directions　with　different　thermal　conductivity　and　thermal　expansion　coefficients　because　of　the　distribution　of　W　in　CuNi　and　the　existence　of　pores.　The　study　shows　that　the　W-Ni-Cu　alloy　parts　exhibiting　better　performance　can　be　manufactured　directly　using　SLM.　©　2019,　Science　Press.　All　right　reserved.