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摘要:
Crystalline and amorphous cobalt-phosphorus (Co-P) coatings have their own advantages in interfacial dif-fusion resistance and mechanical ductility of solder joints, respectively, but it cannot be better at both. In this work, the hybrid crystalline-amorphous Co-P coating (Co-9.1 at.% P) was fabricated and applied on the Cu/Sn interface by controlling the crystallinity through compositional design. Combining the advan-tages of crystalline and amorphous Co-P, strategies for solder joints with high shear strength, ductile inter -metallic compounds (IMCs) and slow interface consumption was proposed. The evolution, microstructure, phase, and mechanical properties of the Co-Sn, Co-Sn-P and P-rich layers in solid-state diffusion were sys-tematically characterized and tested by means of SEM, EPMA, EBSD, TEM, nanoindentation, and shear test. It was found that the hybrid Co-P coating achieved a low consumption rate, 14.2 nm/h, attributing to the par-tially crystalline structure and the Co-Sn-P exfoliation behavior. In addition, solder joints containing large -thickness ductile Co-Sn IMCs, 3.2-3.6 GPa of hardness, was established. The shear strength after aging reached 75.4 MPa relying on the large thickness of Co-Sn IMCs. Severe mechanical loads would be able to be withstand by virtue of the plastic deformation of ductile IMCs. Hybrid crystalline-amorphous Co-P would be a promising interface material in microelectronic packaging.(c) 2022 The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
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MATERIALS & DESIGN
ISSN: 0264-1275
年份: 2022
卷: 224
8 . 4
JCR@2022
8 . 4 0 0
JCR@2022
ESI学科: MATERIALS SCIENCE;
ESI高被引阀值:66
JCR分区:1
中科院分区:2
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