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作者:

Wang, Meilin (Wang, Meilin.) | Wei, Wu (Wei, Wu.) | Shi, Wei (Shi, Wei.) | Zhou, Xiaorong (Zhou, Xiaorong.) | Wen, Shengping (Wen, Shengping.) | Wu, Xiaolan (Wu, Xiaolan.) | Gao, Kunyuan (Gao, Kunyuan.) | Rong, Li (Rong, Li.) | Qi, Peng (Qi, Peng.) | Huang, Hui (Huang, Hui.) | Nie, Zuoren (Nie, Zuoren.)

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EI Scopus SCIE

摘要:

Isothermal hot compression experiments of homogenized Al-Mg-Si-Er-Zr alloy were conducted at temperatures ranging from 350 to 500 degrees C and strain rates of 0.01-10 s-1on a Gleeble-3500 thermal simulation tester. The hot deformation behavior and optimum pro-cessing parameters of the alloy were determined by analyzing the flow curves and pro-cessing maps. Characterization of the microstructures of the deformed specimens was done using electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM), and the geometrically necessary dislocation (GND) density was used based on the kernel average misorientation (KAM). The results showed that the GND density decreased with a decrease in the strain rate and with an increase in the deformation temperature. Dynamic recovery and continuous dynamic recrystallization were the main softening mechanisms during hot deformation, and dynamic recovery was dominant. It was found that the capacity for dynamic recovery was reduced, while dynamic recrystallization was prevented in the Al-Mg-Si-Er-Zr alloy. This was a result of hindered dislocations and sub-grain boundary movement caused by the pinning of dislocations and sub-grain boundaries from the Mg2Si, Al(MnFe)Si, and Al3(Er, Zr) particles. The addition of Er and Zr resulted in an increase in the activation energy, which can be attributed to the formation of Al3(Er, Zr) particles.(c) 2022 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

关键词:

Microstructure characterization Al-Mg-Si-Er-Zr alloy Microstructure evolution Dynamic recrystallization Hot deformation

作者机构:

  • [ 1 ] [Wang, Meilin]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China
  • [ 2 ] [Wei, Wu]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China
  • [ 3 ] [Wen, Shengping]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China
  • [ 4 ] [Wu, Xiaolan]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China
  • [ 5 ] [Gao, Kunyuan]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China
  • [ 6 ] [Rong, Li]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China
  • [ 7 ] [Qi, Peng]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China
  • [ 8 ] [Huang, Hui]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China
  • [ 9 ] [Nie, Zuoren]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China
  • [ 10 ] [Shi, Wei]Inst Corros Sci & Technol, Guangzhou 510530, Peoples R China
  • [ 11 ] [Zhou, Xiaorong]Univ Manchester, Dept Mat, Manchester M13, England

通讯作者信息:

  • [Wei, Wu]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China;;[Huang, Hui]Beijing Univ Technol, Key Lab Adv Funct Mat, Educ Minist China, Beijing, Peoples R China;;

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来源 :

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

ISSN: 2238-7854

年份: 2023

卷: 22

页码: 947-957

6 . 4 0 0

JCR@2022

被引次数:

WoS核心集被引频次: 15

SCOPUS被引频次: 18

ESI高被引论文在榜: 0 展开所有

万方被引频次:

中文被引频次:

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