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作者:

Jia, Qiang (Jia, Qiang.) | Zou, Guisheng (Zou, Guisheng.) | Zhang, Hongqiang (Zhang, Hongqiang.) | Deng, Zhongyang (Deng, Zhongyang.) | Wang, Wengan (Wang, Wengan.) | Liu, Lei (Liu, Lei.) | Ma, Limin (Ma, Limin.) | Guo, Fu (Guo, Fu.) (学者:郭福)

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EI Scopus SCIE

摘要:

Nano-Ag sintering can realize superior thermal, electrical, and mechanical properties for power electronic packaging, while it suffers from unstable microstructure and electrochemical migration. In this work, a super-saturated Ag2.8 wt%Cu nanoalloy film has been developed using pulsed laser deposition, which can be sintered at 250 degrees C in air for electronic packaging without sacrificing bondability. It was surprisingly found that both thermal stability and electrochemical migration resistance were significantly improved when alloying the Ag with 2.8 wt% Cu. The in situ formed Cu2O/CuO from Ag-Cu nanoalloy existed on the pore surface and along the grain boundaries of Ag/Ag-Cu nanoalloy, which stabilized the microstructure of bondline from 400 h to 1400 h at 300 degrees C. The synergistic effect of Ag-Cu nanoalloy and Cu oxides realized an obvious protective effect in the process of anodic dissolution, exhibiting a short-circuit time 2.4 times of the pure Ag electrode. The die attach process is compatible with most commercial equipment and Si/SiC dies with improved performance, enabling the supersaturated Ag-Cu nanoalloy to be a promising material for high reliability power electronic packaging.

关键词:

Power electronic packaging Thermal and electrochemical stability Low temperature sintering Ag-Cu nanoalloy

作者机构:

  • [ 1 ] [Jia, Qiang]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 2 ] [Liu, Lei]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 3 ] [Ma, Limin]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 4 ] [Guo, Fu]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 5 ] [Jia, Qiang]Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China
  • [ 6 ] [Zou, Guisheng]Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China
  • [ 7 ] [Deng, Zhongyang]Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China
  • [ 8 ] [Wang, Wengan]Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China
  • [ 9 ] [Liu, Lei]Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol, Beijing 100084, Peoples R China
  • [ 10 ] [Zhang, Hongqiang]Beihang Univ, Sch Mech Engn & Automat, Beijing 100191, Peoples R China
  • [ 11 ] [Guo, Fu]Beijing Union Univ, Coll Robot, Beijing 100101, Peoples R China

通讯作者信息:

  • [Liu, Lei]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China;;[Guo, Fu]Beijing Univ Technol, Fac Mat & Mfg, Beijing 100124, Peoples R China;;

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来源 :

APPLIED SURFACE SCIENCE

ISSN: 0169-4332

年份: 2023

卷: 612

6 . 7 0 0

JCR@2022

ESI学科: MATERIALS SCIENCE;

ESI高被引阀值:26

被引次数:

WoS核心集被引频次: 7

SCOPUS被引频次: 11

ESI高被引论文在榜: 0 展开所有

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