To　deal　with　the　increasingly　severe　thermal　issues　in　integrated　circuits,　the　flow　and　heat　transfer　characteristics　of　the　fluid　in　S-R,　S-Z,　D-R　and　D-R-Z　are　experimentally　investigated.　The　results　indicate　that±　the　pressure　drop　of　these　four　structures　increases　gradually　under　the　same　flow　rate,　the　heat　transfer　characteristics　of　double-layer　channels　is　better　than　single-layer　channel.　In　the　D-R　structure,　when　the　rectangular　channel　with　more　heat　absorption　replaced　by　zigzag　channel,　the　overall　performance　is　improved.　©　2019,　Science　Press.　All　right　reserved.