PP　IGBTs　have　been　widely　used　in　high-temperature　electronic　field.　The　study　of　thermal　contact　resistance　is　very　important　for　thermal　management,　reliability　evaluation,　life　prediction.　Thermal　contact　resistance　is　the　significant　part　in　the　total　thermal　resistance.　The　influence　of　five　factors　of　surface　morphology　parameters　on　thermal　contact　resistance　is　studied　in　this　paper.　This　paper　used　design　of　experiment　(DOE)　to　design　the　simulation　group,　a　total　of　22　simulation　groups.　The　submodel　technology　is　used　in　finite　element　analysis　to　realize　the　simulation　of　heat　transfer.　The　results　of　DOE　show　that　the　significant　factors　are　the　relative　real　contact　area,　the　distance　between　asperities,　the　angle　of　asperity,　and　the　significant　interaction　factor　between　the　relative　real　contact　area　and　the　angle　of　asperity.　©　2022　IEEE.