Pre-annealing　is　an　essential　process　in　TSV　fabrication,　which　can　relieve　internal　stress　of　TSV-Cu　and　change　its　mechanical　properties.　In　the　subsequent　process,　the　TSV-Cu　structure　has　to　undergo　thermal　load,　and　thermal　deformation　and　thermal　stress　are　unavoidable　due　to　thermal　mismatch　of　interface　materials.　Excessive　thermal　stress　threatens　interface　crack　and　solder　joint　reliability　of　TSV-Cu　structure.　In　this　paper,　the　stress　and　energy　character　of　interfacial　crack　and　solder　joint　of　TSV-Cu　structures　under　thermal　loads　of　25-420-25°C　have　been　investigated　by　FEM　calculation,　and　the　thermomechanical　reliability　of　different　annealed　TSV-Cu　structures　also　has　been　studied.　In　comparison,　the　pre-annealing　process　at　400°C+120　min　is　relatively　the　most　favorable　for　the　thermomechanical　reliability　of　the　TSV-Cu　structure.　©　2022　IEEE.