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作者:

Zheng, Xueheng (Zheng, Xueheng.) | An, Tong (An, Tong.) | Qin, Fei (Qin, Fei.) | Gong, Yanpeng (Gong, Yanpeng.) | Dai, Yanwei (Dai, Yanwei.) | Chen, Pei (Chen, Pei.)

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EI Scopus

摘要:

During the service process, the plastic deformation of Al metallization layer on IGBT surface will lead to the reconstruction of Al metallization layer, which will seriously harm the electrical interconnection between IGBT chip and bonding line. In this paper, a single IGBT chip and its interconnection structure were selected to establish a finite element model, and the temperature and stress distribution law and plastic deformation law of Al metallization layer under power cycle were obtained through electro-thermal-mechanical indirect coupling analysis, which provided help to evaluate the reliability of Al metallization layer of IGBT module. Finite element results show that the power IGBT chip under circulating load Al metallization layer under the surface of the uneven distribution of stress and, center position and bonding line response location near Al metallization layer on the stress and the maximum equivalent plastic strain is larger, indicating that Al metallization layer center and pin locations are more likely to produce reliability problems. © 2022 IEEE.

关键词:

Metallizing Integrated circuit interconnects Finite element method Reliability analysis Stresses Aluminum Plastic deformation Insulated gate bipolar transistors (IGBT)

作者机构:

  • [ 1 ] [Zheng, Xueheng]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing, China
  • [ 2 ] [An, Tong]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China
  • [ 3 ] [Qin, Fei]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China
  • [ 4 ] [Gong, Yanpeng]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China
  • [ 5 ] [Dai, Yanwei]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China
  • [ 6 ] [Chen, Pei]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China

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年份: 2022

语种: 英文

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