Integrated　circuit　chip　manufacturing　is　the　core　area　of　the　national　strategy,　and　wafer　bonding　is　a　key　process　for　3D　advanced　packaging.　In　order　to　solve　the　error　problems　caused　by　optical　alignment,　large　stroke　motion　and　position　calibration.　Based　on　the　magnetic　tunnel　junction　effect,　a　new　wafer　magnetic　alignment　technology　is　proposed　in　this　paper,　which　is　expected　to　reduce　the　difficulty　in　the　design　and　manufacture　of　wafer　bonding　equipment.　The　wafer　magnetic　alignment　scheme　and　mechanism　are　introduced.　The　magnetic　field　distribution　of　wafer　magnetic　field　alignment　is　numerically　simulated　and　visualized.　The　relationship　between　alignment　accuracy　and　the　shape,　magnetic　field　distribution　and　remanence　of　micro　column　markers　is　studied.　The　analysis　shows　that　the　magnetic　alignment　technology　can　achieve　the　wafer　alignment　accuracy　to　1μm.　On　this　basis,　a　wafer　bonding　machine　scheme　is　proposed.　This　research　has　certain　significance　for　promoting　the　development　of　key　technologies　of　advanced　IC　packaging　equipment.　©　2022　IEEE.