Stress analysis of automotive IGBT module under vibration load - 文章详情页

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With　the　development　of　new　energy　vehicles,　its　control　component　(automotive　IGBT　module)　has　met　new　opportunities　and　challenges.　Automotive　IGBT　modules　are　in　severe　service　conditions　and　often　suffer　from　vibration　environment.　Therefore,　the　vibration　analysis　of　automotive　IGBT　module　has　important　practical　significance.　In　this　paper,　finite　element　software　is　used　to　study　the　stress　distribution　of　automotive　IGBT　module　under　two　vibration　modes:　simple　harmonic　vibration　and　random　vibration,　and　a　comparison　is　made.　By　observing　the　stress　nephogram　of　simple　harmonic　vibration　and　random　vibration,　it　can　be　found　that　the　stress　in　the　middle　of　the　module　and　the　root　of　the　bonding　wire　is　larger　in　both　vibration　modes.　©　2022　IEEE.

关键词：

Finite element method Reliability analysis Stress analysis Vibration analysis Insulated gate bipolar transistors (IGBT)

作者机构：

[ 1 ] [Tian, Yanzhong]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China
[ 2 ] [An, Tong]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China
[ 3 ] [Qin, Fei]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China
[ 4 ] [Gong, Yanpeng]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China
[ 5 ] [Dai, Yanwei]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China
[ 6 ] [Chen, Yanpeng]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing, China

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