• 综合
  • 标题
  • 关键词
  • 摘要
  • 学者
  • 期刊-刊名
  • 期刊-ISSN
  • 会议名称
搜索

作者:

Ma, Chong (Ma, Chong.) | Qin, Fei (Qin, Fei.) | Gong, Yanpeng (Gong, Yanpeng.) | Hou, Chuantao (Hou, Chuantao.) | Cheng, Hao (Cheng, Hao.) | He, Qi (He, Qi.)

收录:

EI Scopus

摘要:

With the increasing of packaging density and functional diversity, electronic packaging structures with multiscale features have brought huge demand. To analyze elastoplastic problems of multiscale structures in electronic packaging, this paper presents an efficient coupling scheme of Abaqus and a self-written boundary element method (BEM) code. In the numerical analysis, based on the geometric features of the multiscale structures, the whole domain is divided into two domains: FE domain and BE domain. The Abaqus is used in the FE domain where non-linear or nonhomogeneous behavior is expected, whereas the linear elastic domain or large-scale domain is solved by the BEM code. The BE part in the whole FE-BE model is defined as a super element (user-defined element in Abaqus) of the FE, and its effective stiffness and effective nodal forces at the interfacial boundary are evaluated by the BEM code and assembled by the user subroutine (UEL) into the FE system. Users not only benefit from the powerful functions of Abaqus, but also can use BEM as a complement to improve solution accuracy. The numerical example shows that the stress results obtained by the scheme are in a great agreement with the results obtained by a detailed finite element model. © 2022 IEEE.

关键词:

Electronics packaging ABAQUS Boundary element method Elastoplasticity Sailing vessels

作者机构:

  • [ 1 ] [Ma, Chong]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing, China
  • [ 2 ] [Qin, Fei]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing, China
  • [ 3 ] [Gong, Yanpeng]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing, China
  • [ 4 ] [Hou, Chuantao]Beijing Institute of Structure and Environment Engineering, Science and Technology on Reliability and Environment Engineering Laboratory, Beijing, China
  • [ 5 ] [Cheng, Hao]Beijing Institute of Structure and Environment Engineering, Science and Technology on Reliability and Environment Engineering Laboratory, Beijing, China
  • [ 6 ] [He, Qi]Beijing University of Technology, Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing, China

通讯作者信息:

电子邮件地址:

查看成果更多字段

相关关键词:

相关文章:

来源 :

年份: 2022

语种: 英文

被引次数:

WoS核心集被引频次:

SCOPUS被引频次:

ESI高被引论文在榜: 0 展开所有

万方被引频次:

中文被引频次:

近30日浏览量: 1

归属院系:

在线人数/总访问数:447/4968675
地址:北京工业大学图书馆(北京市朝阳区平乐园100号 邮编:100124) 联系我们:010-67392185
版权所有:北京工业大学图书馆 站点建设与维护:北京爱琴海乐之技术有限公司