A　novel　air-cooled　CPU　heat　sink　integrated　U-shape　micro　heat　pipe　array　with　rectangular　pin　fins　(U-MHPA-RPF)　is　proposed.　The　heat　transfer　and　friction　characteristics　of　U-MHPA-RPF　were　investigated　by　the　wind　tunnel　experimental　set　up　systematically.　The　results　show　that　the　operating　temperature　can　be　reduced　easily　below　75　degrees　C　when　the　input　power　reached　130　W.　The　simplified　three-dimensional　model　was　established　in　ANSYS　ICEM,　the　conjugate　heat　transfer　from　the　CPU　to　the　air　were　computed　numerically　in　ANSYS　Fluent　for　a　range　of　air　flow　at　different　heating　powers.　Verified　by　the　experimental　results,　the　thermal　resistance　of　each　part　of　the　heat　sink　is　discussed.　The　contact　thermal　resistance　is　the　major　component,　the　advantage　of　the　U-MHPA-RPF　heat　sink　is　proved　by　the　lower　values　of　the　thermal　resistance　of　the　heat　sink.　By　changing　the　Reynolds　number,　it　is　found　that　the　cooling　device　could　be　operated　at　small　air　flow　rates　to　reduce　fan　power　consumption　and　noise.