The　Ni-5　at.%W/Ni-9.3　at.%W/Ni-5　at.%W　alloy　composite　substrate　with　a　thickness　of　109　mu　m　was　produced　by　powder　metallurgy　and　rolling　process.　The　composite　substrates　with　different　thicknesses　were　produced　by　electrochemically　polishing　the　outer　layer　of　each　substrate.　When　the　thickness　of　the　composite　substrate　was　reduced　to　72　mu　m,　the　cubic　texture　could　still　reach　97.3%　by　using　electron　backscatter　diffraction.　Moreover,　its　saturation　magnetization　only　reached　2.3　(emu/g).　Finally,　the　cubic　texture　of　composite　substrates　was　found　to　vary　in　thickness　thinning　because　the　grain　growth　mechanism　between　the　inner　and　outer　layers　is　different.　The　inner　layer　defect　has　a　＂pin＂　effect　on　grain　boundary　migration,　and　in　the　outer　layer,　the　cubic　grain　grows　more　easily　to　the　surface　and　along　the　rolling　direction.　However,　the　formation　of　cubic-oriented　grains　is　hindered　by　the　twin　defects　in　the　inner　layer.