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Author:

Zheng, Gangfeng (Zheng, Gangfeng.) | Dong, Hao (Dong, Hao.) | Li, Ze (Li, Ze.) | Liu, Songfeng (Liu, Songfeng.) | Wu, Bin (Wu, Bin.) | He, Cunfu (He, Cunfu.)

Indexed by:

EI Scopus SCIE

Abstract:

In this study, a cylindrical test specimen with a 3D through-hole defect was processed, and the reflected echo data of the defect at different cross-sections were obtained by an ultrasonic testing detection system. On this basis, two data processing methods were designed to obtain two types of 3D reconstruction images of defects, and the reconstruction effects of two methods were compared using the real defects. In general, this study achieved a relatively accurate 3D reconstruction of through-hole defects at a low cost. Our methods provided lower cost than current state-of-the-art approaches.

Keyword:

3D shape reconstruction UT medical volume rendering Born approximation

Author Community:

  • [ 1 ] [Zheng, Gangfeng]Anhui Univ Sci & Technol, Sch Mat Sci & Engn, Huainan, Anhui, Peoples R China
  • [ 2 ] [Dong, Hao]Anhui Univ Sci & Technol, Sch Mat Sci & Engn, Huainan, Anhui, Peoples R China
  • [ 3 ] [Li, Ze]Anhui Univ Sci & Technol, Sch Mat Sci & Engn, Huainan, Anhui, Peoples R China
  • [ 4 ] [Liu, Songfeng]Anhui Univ Sci & Technol, Sch Mat Sci & Engn, Huainan, Anhui, Peoples R China
  • [ 5 ] [Wu, Bin]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 6 ] [He, Cunfu]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing, Peoples R China
  • [ 7 ] [Zheng, Gangfeng]Anhui Univ Sci & Technol, Sch Mat Sci & Engn, 168,Taifeng Rd, Huainan 232001, Anhui, Peoples R China

Reprint Author's Address:

  • [Zheng, Gangfeng]Anhui Univ Sci & Technol, Sch Mat Sci & Engn, 168,Taifeng Rd, Huainan 232001, Anhui, Peoples R China;;

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Source :

RESEARCH IN NONDESTRUCTIVE EVALUATION

ISSN: 0934-9847

Year: 2023

Issue: 6

Volume: 33

Page: 277-296

1 . 4 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:26

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 1

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