Nano-multilayer　films　have　demonstrated　high　viability　as　filler　metals　for　low-temperature　bonding　applications.　This　article　proposes　a　novel　Cu/W　nano-multilayer　film　as　filler　material　for　pulsed　pressure　diffusion　bonding　of　Ti-6Al-4　V　alloy.　Cu/W　nano-multilayer　filler　metal　with　a　single　layer　thickness　of　4　mu　m　had　a　modulation　ratio　of　1:1.　The　effect　of　heating　rate　on　the　properties　of　joints　was　investigated.　The　typical　joint　structure　was　mainly　composed　of　Ti-6Al-4　V　base　metal　region,　CuxTiy　intermetallic　compound　mixed　region,　and　Cu/W　elemental　region.　By　increasing　the　rate　of　heating,　Cu　diffused　into　the　Ti-6Al-4　V　base　metal,　reducing　the　formation　of　brittle　compounds　in　the　bonding　and　enhancing　the　tensile　strength　of　the　joint.　At　the　heating　rate　of　30　degrees　C/s,　the　tensile　strength　of　joint　reached　a　maximum　of　76.7　MPa.　Cu/W　nano-multilayer　film　has　excellent　potential　for　rapid　diffusion　bonding　application.