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Author:

Baia, Kun (Baia, Kun.) | Feng, Shiwei (Feng, Shiwei.) (Scholars:冯士维) | Li, Xuan (Li, Xuan.) | Pan, Shijie (Pan, Shijie.) | Lu, Xiaozhuang (Lu, Xiaozhuang.) | Feng, Zhihong (Feng, Zhihong.) | Zhang, Yamin (Zhang, Yamin.)

Indexed by:

EI Scopus SCIE

Abstract:

Structure functions were originally provided by V. Szekely et al. as a nondestructive method for analyzing the thermal resistance of each layer. In this paper, we propose a numerical calibration of structure functions based on the Cauer RC network. The numerical calibration has practical physical significance and can be used as feedback to form a closed loop system in conjunction with the structure functions. A 3D finite element transient thermal simulation is analyzed by structure functions with different setting parameters to determine the feasibility of the numerical calibration. Furthermore, this numerical method can be used to obtain the transient thermal resistance of an ideal heat dissipation structure from the results of the transient dual interface measurement (TDIM).

Keyword:

Semiconductor devices Reliability estimation Thermal factors TDIM

Author Community:

  • [ 1 ] [Baia, Kun]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Feng, Shiwei]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Xuan]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Pan, Shijie]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Lu, Xiaozhuang]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 6 ] [Zhang, Yamin]Beijing Univ Technol, Beijing 100124, Peoples R China
  • [ 7 ] [Feng, Zhihong]Hebei Semicond Res Inst, Natl Key Lab ASIC, Shijiazhuang 050051, Peoples R China

Reprint Author's Address:

  • [Zhang, Yamin]Beijing Univ Technol, Beijing 100124, Peoples R China;;[Feng, Zhihong]Hebei Semicond Res Inst, Natl Key Lab ASIC, Shijiazhuang 050051, Peoples R China;;

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Source :

MICROELECTRONICS JOURNAL

ISSN: 0026-2692

Year: 2023

Volume: 135

2 . 2 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:19

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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