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作者:

Jiang, Shan (Jiang, Shan.) | Zhang, Meng (Zhang, Meng.) | Meng, Xianwei (Meng, Xianwei.) | Zheng, Xiang (Zheng, Xiang.) | Feng, Shiwei (Feng, Shiwei.) (学者:冯士维) | Zhang, Yamin (Zhang, Yamin.)

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摘要:

The SiC/SiO2 interface state is one of the main factors that limit the performance and reliability of the SiC metal-oxide-semiconductor field-effect transistor (MOSFET). In this article, we use a Bayesian deconvolution algorithm to optimize trap feature extraction based on the transient current method and improve the trap extraction accuracy. Using this method, we study the trap capture mechanism in SiC MOSFETs and mainly characterize the trap position, the trap energy level, and the capture time constant. The results obtained show that there are three different types of traps and defects, two of which are SiC interface traps at the gate-source and gate-drain interfaces, with activation energies of 0.089 and 0.035 eV, respectively, and the third trap type is an oxide trap, and its time constant does not vary with temperature. The characterization results are verified via deep-level transient spectroscopy, and the results show reasonable agreement with those obtained by the method proposed in this article. This method can be combined with electrical stress testing in long-term reliability research to realize nondestructive characterization of the defects of SiC MOSFETs.

关键词:

SiC metal-oxide-semiconductor field-effect transistor (MOSFET) Electron traps Bayes methods Charge trapping Logic gates Reliability trench silicon carbide MOSFET current transient Transient analysis Silicon carbide Deconvolution reliability

作者机构:

  • [ 1 ] [Jiang, Shan]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 2 ] [Zhang, Meng]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 3 ] [Meng, Xianwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 4 ] [Feng, Shiwei]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 5 ] [Zhang, Yamin]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China
  • [ 6 ] [Zheng, Xiang]Univ Bristol, Ctr Device Thermog & Reliabil, Bristol BS8 1TL, England

通讯作者信息:

  • [Zhang, Yamin]Beijing Univ Technol, Inst Semicond Device Reliabil Phys, Beijing 100124, Peoples R China;;

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来源 :

IEEE TRANSACTIONS ON POWER ELECTRONICS

ISSN: 0885-8993

年份: 2023

期: 5

卷: 38

页码: 6555-6565

6 . 7 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:19

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