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作者:

Zhang, Min (Zhang, Min.) | Qin, Fei (Qin, Fei.) | Chen, Si (Chen, Si.) | Dai, Yanwei (Dai, Yanwei.) (学者:代岩伟) | Jin, Yifan (Jin, Yifan.) | Chen, Pei (Chen, Pei.) | An, Tong (An, Tong.) | Gong, Yanpeng (Gong, Yanpeng.)

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EI Scopus SCIE

摘要:

Annealing process is generally adopted to reduce the residual stress and stabilize the microstructure of TSV-Cu in IC manufacturing. In this paper, the effects of capped Cu layer on the protrusion behaviors of TSV-Cu are investigated considering various double annealing processes. Higher protrusions of TSV-Cu with capped Cu layer are observed compared with that of TSV-Cu without capped Cu layer. The reason is that capped Cu layer impedes the elimination of grain boundaries and local misorientation during the first annealing, resulting in the remaining of larger amounts of atoms and higher energy in the grain boundaries. Thus, it is easier to induce protrusion by grain boundary migration during the second annealing. In addition, the capped Cu layer effects on mechanical properties of TSV-Cu under various double annealing conditions are investigated by nanoindentation test. The values of elastic modulus and hardness are generally higher in the presence of capped Cu layer. The reason is also discussed and clarified.

关键词:

capped Cu layer Through-silicon vias double annealing mechanical properties protrusion Mechanical factors Silicon microstructure Through silicon via copper (TSV-Cu) Temperature measurement Microstructure Behavioral sciences Annealing

作者机构:

  • [ 1 ] [Zhang, Min]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 2 ] [Qin, Fei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 3 ] [Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 4 ] [Chen, Pei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 5 ] [An, Tong]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China
  • [ 6 ] [Chen, Si]China Elect Prod Reliabil & Environm Testing Res I, Sci & Technol Reliabil Phys & Applicat Elect Compo, Guangzhou 510610, Peoples R China
  • [ 7 ] [Jin, Yifan]Aerosp Internet Things Technol Co Ltd, Beijing 100124, Peoples R China

通讯作者信息:

  • [Qin, Fei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China;;[Dai, Yanwei]Beijing Univ Technol, Inst Elect Packaging Technol & Reliabil, Fac Mat & Mfg, Beijing 100124, Peoples R China;;

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来源 :

IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

ISSN: 1530-4388

年份: 2023

期: 1

卷: 23

页码: 89-98

2 . 0 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:19

被引次数:

WoS核心集被引频次: 8

SCOPUS被引频次: 8

ESI高被引论文在榜: 0 展开所有

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中文被引频次:

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