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Abstract:
The effects of different kinds of interface treatment on the characteristic of AlGaN/GaN MIS-HEMTs were studied in this paper. N2 and NH3 plasma pretreatment were used to improve the interface quality. The results show that N2 plasma pretreatment could reduce the current collapse of devices. By optimizing the time of N2 plasma pretreatment, it was found that the dynamic characteristic of devices with 10 min the pretreatment was improved, while that of 30 min was degraded. As a gate dielectric intercalation layer, the annealed AlN interlayer can effectively improve the dynamic characteristic of the device. The Vth hysteresis was decreased from 411 mV to 111 mV, and the device current collapse factor was reduced from 42.04 to 4.76 after under OFF-state VD stress of 900. © 2019, Science Press. All right reserved.
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Chinese Journal of Luminescence
ISSN: 1000-7032
Year: 2019
Issue: 7
Volume: 40
Page: 915-921
Cited Count:
SCOPUS Cited Count: 1
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 0
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