• 综合
  • 标题
  • 关键词
  • 摘要
  • 学者
  • 期刊-刊名
  • 期刊-ISSN
  • 会议名称
搜索

作者:

Dai, Yanwei (Dai, Yanwei.) | Zhao, Shuai (Zhao, Shuai.) | Qin, Fei (Qin, Fei.) | An, Tong (An, Tong.) | Gong, Yanpeng (Gong, Yanpeng.) | Chen, Pei (Chen, Pei.)

收录:

EI Scopus

摘要:

Enhancement of the fracture resistance for sintered silver joints has been one of the critical issues that considered frequently in engineering practice. In this paper, different micropatterned sintered silver joints were fabricated. Through end notch flexural test, the load displacement curves for various kinds of micropatterned joints are presented. The shearing fracture toughness and shearing fracture characteristics for different micropatterned joints are also given. The maximum shearing fracture toughness is obtained under the grid groove samples with the highest shearing fracture toughness obtained at 356.95 ± 27.45 J/m2, which is about 7.8 times of that without micropatterned joints. It is also found that the shearing fracture toughness is strongly dependent on the groove depth of the micropatterns. The cracking morphology shows that the crack extension was mainly in a cohesive mode but was also associated with locally interfacial debonding failure that occurred at the groove locus. Although the micropatterns lead to the increase of shearing fracture toughness of adhesively bonded joints and even some of the tested P-δ curves shows the ductile fracture manner, the macro fracture morphology of the crack in sintered silver shows that the cracking in micropatterned joints still presents brittle fracture manner. © 2023 Elsevier Ltd

关键词:

Silver Sintering Morphology Shearing Copper Adhesive joints Ductile fracture Adhesives Cracks Brittle fracture Fracture toughness

作者机构:

  • [ 1 ] [Dai, Yanwei]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 2 ] [Dai, Yanwei]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Zhao, Shuai]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 4 ] [Qin, Fei]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 5 ] [Qin, Fei]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 6 ] [An, Tong]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 7 ] [An, Tong]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 8 ] [Gong, Yanpeng]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 9 ] [Gong, Yanpeng]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China
  • [ 10 ] [Chen, Pei]Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing; 100124, China
  • [ 11 ] [Chen, Pei]Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing; 100124, China

通讯作者信息:

电子邮件地址:

查看成果更多字段

相关关键词:

来源 :

International Journal of Adhesion and Adhesives

ISSN: 0143-7496

年份: 2023

卷: 125

ESI学科: MATERIALS SCIENCE;

ESI高被引阀值:26

被引次数:

WoS核心集被引频次:

SCOPUS被引频次: 3

ESI高被引论文在榜: 0 展开所有

万方被引频次:

中文被引频次:

近30日浏览量: 0

归属院系:

在线人数/总访问数:386/4859686
地址:北京工业大学图书馆(北京市朝阳区平乐园100号 邮编:100124) 联系我们:010-67392185
版权所有:北京工业大学图书馆 站点建设与维护:北京爱琴海乐之技术有限公司