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作者:

Huang, Rui (Huang, Rui.) | Wang, Zhiyong (Wang, Zhiyong.) | Li, Hui (Li, Hui.) | Wang, Qing (Wang, Qing.) | Guo, Yecai (Guo, Yecai.)

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摘要:

In this work, the surface morphology and internal defect evolution process of GaAs substrates implanted with light ions of different fluence combinations are studied. The influence of H and He ions implantation on the atomic mechanism of the blister phenomenon observed after annealing is investigated. Raman spectroscopy is used to measure the surface stress change of different samples before and after implantation and annealing. Optical microscopy and atomic force microscopy are used to characterize the morphology changes of the GaAs surface under different annealing conditions. The evolution of bubbles and defects in GaAs crystals is revealed by transmission electron microscopy. Through this study, it is hoped that ion implantation fluence, surface exfoliation efficiency and exfoliation cost can be optimized. At the same time, it also lays a foundation for the heterointegration of GaAs film on Si. © 2023 Chinese Institute of Electronics.

关键词:

High resolution transmission electron microscopy Semiconducting gallium Annealing Surface morphology Gallium arsenide Silicon III-V semiconductors Hydrogen Morphology Silicon compounds Helium Surface stress Ions

作者机构:

  • [ 1 ] [Huang, Rui]School of Electronic and Information Engineering, Wuxi University, Wuxi; 214105, China
  • [ 2 ] [Wang, Zhiyong]Institute of Advanced Technology on Semiconductor Optics & Electronics, Institute of Laser Engineering, Beijing University of Technology, Beijing; 100124, China
  • [ 3 ] [Li, Hui]School of Electronic and Information Engineering, Wuxi University, Wuxi; 214105, China
  • [ 4 ] [Wang, Qing]School of Electronic and Information Engineering, Wuxi University, Wuxi; 214105, China
  • [ 5 ] [Guo, Yecai]School of Electronic and Information Engineering, Wuxi University, Wuxi; 214105, China

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来源 :

Journal of Semiconductors

ISSN: 1674-4926

年份: 2023

期: 5

卷: 44

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