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Abstract:
Conventional solder joints were prone to remelting during multiple reflow packages, causing the chip and substrate to collapse and trigger a short circuit in the device. Sn-based Cu-cored solder joints avoid remelting and have better thermal fatigue resistance than conventional solder joints. The morphology evolution and thermal fatigue behavior of pure Sn Cu-cored and SAC305 Cu-cored BGA solder joints during thermal fatigue were investigated. The presence of Ag3Sn eutectic network in the SAC305 Cu-cored BGA solder joints provided higher mechanical properties. The morphology evolution during thermal fatigue is more moderate than that of pure Sn Cu-cored BGA solder joints. Pure Sn Cu-cored BGA solder joints are not strengthened by alloying elements and heterogeneous particles, and recrystallization already occurs in the early stages of thermal fatigue. However, at the same thermal fatigue cycle, early recovery phenomenon occur in the SAC305 Cu-cored BGA solder joints. In addition, comparative analysis of SAC305 Cu-cored and conventional SAC305 BGA solder joints during thermal fatigue is defined by finite element analysis. The results show that the Cu core ensures that both sides of the substrate are coplanar, further avoiding the effects of shear stress and reducing thermal fatigue damage.
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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN: 0957-4522
Year: 2023
Issue: 17
Volume: 34
2 . 8 0 0
JCR@2022
ESI Discipline: MATERIALS SCIENCE;
ESI HC Threshold:26
Cited Count:
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count:
Chinese Cited Count:
30 Days PV: 0
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