2.5D　interposer　technology　has　gotten　a　lot　of　attention　as　a　viable　solution　to　high　IO　density,　cost,　and　performance　challenges.　Glass　is　a　potential　choice　as　an　interposer　material　in　an　integrated　package,　with　low　dielectric　loss　and　simple　processing,　it　can　be　a　low-cost　alternative　to　silicon　interposer.　In　this　paper,　a　2.5D　package　using　glass　interposer　with　a　size　of　10　mm　x　15　mm　x　0.8　mm　is　developed.　The　interposer　with　through　glass　via　(TGV)　technology　simplifies　the　process　and　dramatically　reduces　manufacturing　costs,　which　is　especially　important　for　the　system　in　package.　Several　key　processes　are　developed　and　discussed.　To　optimize　the　wafer　level　warpage　problem,　finite　element　modeling　is　used　to　simulate　the　warpage　of　glass　wafers　and　optimize　the　process　parameters　and　material　parameters.　Finally,　the　package　level　reliability　tests　are　conducted　on　the　2.5D　packages,　after　pro-conditional　level　3　and　temperature　cycling　tests,　and　the　final　packages　pass　the　reliability　tests　without　significant　failure　mode,　which　provides　an　important　reference　value　for　the　subsequent　mass-production　of　the　TGV　interposer.