A　4　μm　thick　Sn　film　was　deposited　on　the　copper　substrate　by　electroplating.　Two　copper　substrates　with　electroplated　Sn　were　constituted　of　a　Cu/Sn/Cu　structure.　240　and　1　N　were　chosen　as　soldering　temperature　and　pressure　to　be　soldered　for　different　time　to　investigate　the　law　of　microstructural　evolution　of　IMCs.　The　three-dimensional　morphology　of　Cu6Sn5　and　Cu3Sn　under　different　soldering　temperature(240,　270,　300)　were　fabricated,　Investigate　the　effect　of　temperature　on　three-dimensional　morphology.　The　results　show　Cu6Sn5　was　planar　after　soldered　for　30　min　and　turned　into　scallop-like　with　the　increase　of　soldering　time.　Cu3Sn　in　the　bottom　of　scallop　was　thicker　than　that　in　bottom　of　scallop　on　both　sides.　Sn　was　reacted　with　the　increase　of　soldering　time,　Cu6Sn5　in　the　two　side　merged　into　a　whole　gradually.　Increase　more　soldering　time,　Cu6Sn5　continued　to　be　transformed　into　Cu3Sn.　The　three-dimensional　of　Cu6Sn5　transformed　from　polyhedron　shape　to　procumbent　and　the　size　of　Cu3Sn　grains　decreased　gradually　with　the　increase　of　soldering　temperature.　©　2018,　Editorial　Board　of　Transactions　of　the　China　Welding　Institution,　Magazine　Agency　Welding.　All　right　reserved.