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作者:

Li, Yuan (Li, Yuan.) | Zhao, Yuanfu (Zhao, Yuanfu.) | Huang, Alex Q. (Huang, Alex Q..) | Zhang, Liqi (Zhang, Liqi.) | Huang, Qingyun (Huang, Qingyun.) | Yu, Ruiyang (Yu, Ruiyang.) | Sen, Soumik (Sen, Soumik.) | Ma, Qingxuan (Ma, Qingxuan.) | He, Yunlong (He, Yunlong.)

收录:

EI SCIE

摘要:

High-voltage enhancement-mode (E-mode) gallium nitride (GaN) high electron mobility transistor (HEMT) is a superior candidate to enable higher efficiency and higher power density when compared with silicon power devices in power converter applications. However, the dynamic R-DS,R-ON problem affects the conduction loss of the converter and remains one of the major issues that must be resolved. In this study, a comprehensive experimental evaluation and analysis method of the temperature-dependent dynamic R-DS,R-ON of GaN HEMT in a circuit level is proposed. A commercial E-mode GaN HEMT (GS66508T) is used as a sample to study the temperature-dependent dynamic R-DS,R-ON using a double-pulse-tester. The temperature-dependent dynamic R-DS,R-ON under different DC-link voltages and different load currents are studied and the results show a non-monotonic temperature-dependence of the dynamic R-DS,R-ON. It is concluded that the temperature dependence of the buffer-induced trapping and de-trapping effect, and the temperature dependence of electron mobility together influence the dynamic R-DS,R-ON of E-mode GaN HEMT device during operation. This finding is important since in converter applications the devices are typically operating at elevated temperatures. The proposed comprehensive experimental method can be used to estimate and analyse the dynamic R-DS,R-ON characteristics of other GaN devices.

关键词:

buffer-induced trapping effect circuit level commercial E-mode gallium nitride HEMT devices conduction loss DC-link voltages de-trapping effect double-pulse-tester electron mobility elemental semiconductors enhancement-mode gallium nitride HEMTs gallium compounds gallium nitride high electron mobility transistor GaN high electron mobility transistors high-voltage enhancement-mode gallium nitride high electron mobility transistor III-V semiconductors nonmonotonic temperature-dependence power converter applications power density semiconductor device testing Si silicon silicon power devices temperature dependence dynamic resistance wide band gap semiconductors

作者机构:

  • [ 1 ] [Li, Yuan]Beijing Univ Technol, Fac Informat Technol, 100 Pingle Yuan, Beijing, Peoples R China
  • [ 2 ] [Zhao, Yuanfu]Beijing Univ Technol, Fac Informat Technol, 100 Pingle Yuan, Beijing, Peoples R China
  • [ 3 ] [Li, Yuan]Univ Texas Austin, Semicond Power Elect Ctr, Austin, TX 78712 USA
  • [ 4 ] [Huang, Alex Q.]Univ Texas Austin, Semicond Power Elect Ctr, Austin, TX 78712 USA
  • [ 5 ] [Zhang, Liqi]Univ Texas Austin, Semicond Power Elect Ctr, Austin, TX 78712 USA
  • [ 6 ] [Huang, Qingyun]Univ Texas Austin, Semicond Power Elect Ctr, Austin, TX 78712 USA
  • [ 7 ] [Yu, Ruiyang]Univ Texas Austin, Semicond Power Elect Ctr, Austin, TX 78712 USA
  • [ 8 ] [Sen, Soumik]Univ Texas Austin, Semicond Power Elect Ctr, Austin, TX 78712 USA
  • [ 9 ] [Ma, Qingxuan]Univ Texas Austin, Semicond Power Elect Ctr, Austin, TX 78712 USA
  • [ 10 ] [He, Yunlong]Xidian Univ, Sch Microelect, Xian 710071, Peoples R China

通讯作者信息:

  • [Zhao, Yuanfu]Beijing Univ Technol, Fac Informat Technol, 100 Pingle Yuan, Beijing, Peoples R China

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来源 :

IET POWER ELECTRONICS

ISSN: 1755-4535

年份: 2020

期: 3

卷: 13

页码: 456-462

2 . 0 0 0

JCR@2022

ESI学科: ENGINEERING;

ESI高被引阀值:28

JCR分区:2

被引次数:

WoS核心集被引频次: 6

SCOPUS被引频次: 4

ESI高被引论文在榜: 0 展开所有

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中文被引频次:

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