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作者:

Jia, Wenxu (Jia, Wenxu.) | Hou, Yudong (Hou, Yudong.) (学者:侯育冬) | Zheng, Mupeng (Zheng, Mupeng.) | Xu, Yuru (Xu, Yuru.) | Zhu, Mankang (Zhu, Mankang.) | Yang, Kuiyong (Yang, Kuiyong.) | Cheng, Huarong (Cheng, Huarong.) | Sun, Shuying (Sun, Shuying.) | Xing, Jie (Xing, Jie.)

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EI

摘要:

Ceramic capacitors with upper operating temperatures far beyond 200°C are essential for high-temperature electronics used in deep oil drilling, aviation, automotive industry and so on. Recent advances in existing lead-free dielectrics for potential high-temperature capacitor applications are reviewed and grouped into three categories according to the parent component of the solid solution. Their desirable temperature stabilities were summarised comprehensively. However, there are still some limitations in the current research, such as achieving low loss in a wide temperature range and maintaining stable dielectric properties with different frequencies or at different voltages. Furthermore, the successful implementation of multilayer ceramic capacitors is one of the biggest challenges, which will have far-reaching impacts on the realisation of high-temperature capacitor application in the future. © 2018 Institution of Engineering and Technology. All rights reserved.

关键词:

Ceramics industry Dielectric materials Automotive industry Dielectric properties Capacitors Electronics industry Ceramic capacitors High temperature applications

作者机构:

  • [ 1 ] [Jia, Wenxu]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
  • [ 2 ] [Hou, Yudong]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
  • [ 3 ] [Zheng, Mupeng]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
  • [ 4 ] [Xu, Yuru]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
  • [ 5 ] [Zhu, Mankang]College of Materials Science and Engineering, Beijing University of Technology, Beijing, China
  • [ 6 ] [Yang, Kuiyong]Materials R and D Department, Beijing Yuanliu Hongyuan Electronic Technology Company, Ltd, Beijing, China
  • [ 7 ] [Cheng, Huarong]Materials R and D Department, Beijing Yuanliu Hongyuan Electronic Technology Company, Ltd, Beijing, China
  • [ 8 ] [Sun, Shuying]Materials R and D Department, Beijing Yuanliu Hongyuan Electronic Technology Company, Ltd, Beijing, China
  • [ 9 ] [Xing, Jie]Materials R and D Department, Beijing Yuanliu Hongyuan Electronic Technology Company, Ltd, Beijing, China

通讯作者信息:

  • 侯育冬

    [hou, yudong]college of materials science and engineering, beijing university of technology, beijing, china

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来源 :

IET Nanodielectrics

年份: 2018

期: 1

卷: 1

页码: 3-16

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SCOPUS被引频次: 71

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