Hierarchical　nanostructured　W-Cu　composite　with　an　average　W　size　below　200　nm　and　nanocrystalline　structure　inside　the　W　phase　was　obtained　by　refining　the　inner　structure　of　the　initial　ultrafine　powders　combined　with　high-pressure　spark　plasma　sintering.　It　revealed　that　an　atomic　scale　combination　can　be　formed　at　both　the　W　grain　boundaries　and　W/Cu　interfaces.　Accordingly,　the　nanostructured　W-Cu　composite　exhibits　twofold　hardness　and　greatly　improved　wear　resistance　with　satisfactory　electrical　conductivity,　as　compared　to　those　of　their　fine　grain　structured　counterparts.　The　upgraded　wear　resistance　is　attributed　to　the　restricted　micro-plowing　and　the　mechanically　mixed　layer,　induced　by　a　refined　microstructure,　intrinsic　high　hardness,　and　the　composition　modulation　on　the　wear　surface.