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Author:

崔碧峰 (崔碧峰.) | 刘梦涵 (刘梦涵.) | 凌小涵 (凌小涵.) | 何新 (何新.)

Indexed by:

incoPat

Abstract:

一种P型金属电极制备焊料的半导体激光器属于半导体光电子技术领域。本发明的提出是为了解决倒装焊时,半导体激光器管芯与热沉之间由于共熔性差导致的焊层内部存在空隙、焊接不牢等问题。本发明涉及的半导体激光器关键结构在于在P型金属电极上制备Au‑Sn焊料层。该Au‑Sn焊料层有两种结构,一种是Au、Sn分层结构,另一种是Au‑Sn合金结构,两种结构中Au、Sn的质量比均为80 : 20。本发明提高了焊接质量,延长了器件的寿命,对于器件长期高可靠性工作十分有利。

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Patent Info :

Type: 发明授权

Patent No.: CN201410323169.0

Filing Date: 2014-07-08

Publication Date: 2017-12-01

Pub. No.: CN104104009B

Applicants: 北京工业大学

Legal Status: 授权

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 2

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