Design of Improved Interdigital Capacitive Proximity Sensor Used for Dielectric Property Detection of Thickness Gradual Changed Structure - Details

Author：

Jiao, Jingpin (Jiao, Jingpin.) (Scholars：焦敬品) | Li, Liang (Li, Liang.) | He, Cunfu (He, Cunfu.) (Scholars：何存富) | Wu, Bin (Wu, Bin.)

Indexed by：

EI Scopus PKU CSCD

Abstract：

Aiming　at　the　problem　of　dielectric　property　detection　of　polymer　materials　with　thickness　gradual　changes　structure,　an　improved　interdigital　capacitive　proximity　sensor　is　designed.　Finite　element　simulation　method　is　proposed　to　investigate　the　effects　of　different　number　of　fingers　and　metallization　ratio　on　the　signal　strength　and　penetration　depth,　and　the　scope　of　the　single　pair　interdigital　unit　width　is　determined.　The　influence　of　different　interdigital　unit　width　and　metallization　ratio　for　the　sensor　performances　are　carried　out,　the　penetration　depth　curves　are　acquired.　Based　on　the　structure　characteristics　of　the　materials　under　test,　the　width　of　each　finger　which　composed　the　interdigital　sensor　electrodes　is　optimized　individually.　An　improved　interdigital　capacitive　proximity　sensor　is　designed.　The　results　of　simulation　and　experimental　indicate　that　the　signal　strength　and　sensitivity　are　better　than　the　traditional　interdigital　sensors,　thus　the　improved　interdigital　sensor　is　more　suitable　for　the　dielectric　property　detection　of　the　gradual　change　thickness　structure.　©　2017　Journal　of　Mechanical　Engineering.

Keyword：

Dielectric properties Capacitive sensors Proximity sensors Penetration depth (superconductivity) Metallizing Dielectric materials

Author Community：

[ 1 ] [Jiao, Jingpin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
[ 2 ] [Jiao, Jingpin]Beijing Engineering Research Center of Precision Measurement Technology and Instruments, Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Li, Liang]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
[ 4 ] [He, Cunfu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
[ 5 ] [He, Cunfu]Beijing Engineering Research Center of Precision Measurement Technology and Instruments, Beijing University of Technology, Beijing; 100124, China
[ 6 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing; 100124, China
[ 7 ] [Wu, Bin]Beijing Engineering Research Center of Precision Measurement Technology and Instruments, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address：

焦敬品
[jiao, jingpin]college of mechanical engineering and applied electronics technology, beijing university of technology, beijing; 100124, china;;[jiao, jingpin]beijing engineering research center of precision measurement technology and instruments, beijing university of technology, beijing; 100124, china

Email：

jiaojp@bjut.edu.cn

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