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Author:

Hou, Chao (Hou, Chao.) | Lu, Hao (Lu, Hao.) | Zhao, Zhi (Zhao, Zhi.) | Huang, Xintao (Huang, Xintao.) | Han, Tielong (Han, Tielong.) | Luan, Junhua (Luan, Junhua.) | Jiao, Zengbao (Jiao, Zengbao.) | Song, Xiaoyan (Song, Xiaoyan.) (Scholars:宋晓艳) | Nie, Zuoren (Nie, Zuoren.)

Indexed by:

EI Scopus SCIE

Abstract:

The challenge of fabricating nanostructured W-Cu composites by powder metallurgy has been solved by means of modulated phase separation. A hierarchically nanostructured (HN) W-Cu composite was prepared using intermediary Al through sluggish asynchronous phase separation. In addition to a dual network composed of a Cu phase and the W-Cu nanostructure, dense Al-containing nanoprecipitates with a body-centered cubic (bcc) structure are distributed in the W matrix. Compared with a pristine W/Cu interface, the newly formed W/Cu interfaces modulated by Al and the coherent W/Al-containing particle interfaces possess lower energy and enhanced bonding strength due to efficient electron transfer and strong coupling interactions. With a large number of stable heterogeneous interfaces and a "selflocking" geometry, the HN W-Cu composite exhibits excellent resistance against plastic deformation. The combination of the presented composite's hardness and compressive strength outperforms all other sintered W-Cu composites with the same Cu content. Under a reciprocating sliding load, the reactive Al prevents excessive oxidation. The excellent synergy of the hardness and toughness of the friction-induced surface endows the HN composite with high abrasion resistance. This study provides a new strategy to modulate the structure and energy state of interfaces in metallic composites containing immiscible components in order to achieve high mechanical performance. (c) 2023 THE AUTHORS. Published by Elsevier LTD on behalf of Chinese Academy of Engineering and Higher Education Press Limited Company.

Keyword:

Mechanical properties Phase separation Immiscible-component composite Nanostructure Interface modulation

Author Community:

  • [ 1 ] [Hou, Chao]Beijing Univ Technol, Fac Mat & Mfg, Key Lab Adv Funct Mat, Minist Educ, Beijing 100124, Peoples R China
  • [ 2 ] [Lu, Hao]Beijing Univ Technol, Fac Mat & Mfg, Key Lab Adv Funct Mat, Minist Educ, Beijing 100124, Peoples R China
  • [ 3 ] [Zhao, Zhi]Beijing Univ Technol, Fac Mat & Mfg, Key Lab Adv Funct Mat, Minist Educ, Beijing 100124, Peoples R China
  • [ 4 ] [Huang, Xintao]Beijing Univ Technol, Fac Mat & Mfg, Key Lab Adv Funct Mat, Minist Educ, Beijing 100124, Peoples R China
  • [ 5 ] [Han, Tielong]Beijing Univ Technol, Fac Mat & Mfg, Key Lab Adv Funct Mat, Minist Educ, Beijing 100124, Peoples R China
  • [ 6 ] [Song, Xiaoyan]Beijing Univ Technol, Fac Mat & Mfg, Key Lab Adv Funct Mat, Minist Educ, Beijing 100124, Peoples R China
  • [ 7 ] [Nie, Zuoren]Beijing Univ Technol, Fac Mat & Mfg, Key Lab Adv Funct Mat, Minist Educ, Beijing 100124, Peoples R China
  • [ 8 ] [Luan, Junhua]City Univ Hong Kong, Dept Mat Sci & Engn, Hong Kong 999077, Peoples R China
  • [ 9 ] [Jiao, Zengbao]Hong Kong Polytech Univ, Dept Mech Engn, Hong Kong 999077, Peoples R China

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Source :

ENGINEERING

ISSN: 2095-8099

Year: 2023

Volume: 26

Page: 173-184

1 2 . 8 0 0

JCR@2022

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 8

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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