Flow and heat transfer characteristics of interlayer liquid cooling for 3D-IC with two stacked layers - 文章详情页

作者：

Ma, Dandan (Ma, Dandan.) | Xia, Guodong (Xia, Guodong.) (学者：夏国栋) | Chen, Zhuo (Chen, Zhuo.) | Wang, Zhuo (Wang, Zhuo.)

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摘要：

With　the　vertical　stacking　of　circuit　layers,　the　power　density　of　3D-IC　increases　exponentially.　Interlayer　liquid　cooling　is　a　promising　and　scalable　solution　for　high　heat　flux　removal　in　3D-IC　(three-dimensional　integration　circuit).　The　flow　and　heat　transfer　performances　of　water　through　uniform　and　double-side　heat　flux　3D-IC　of　interlayer　in-line　micro-pin　fins　structure　with　heat　transfer　areas　of　1　cm2　and　Reynolds　number　ranging　from　150　to　900　were　studied　numerically.　3D-IC　with　in-line　micro-pin　fins　for　pitches　of　200　μm,　diameter　of　100　μm　and　heights　of　200　μm　was　analyzed.　Results　show　that　interlayer　liquid　cooling　of　3D-IC　with　in-line　micro-pin　fins　has　better　heat　exchange　effect　than　that　with　rectangular　micro-channels.　For　the　Reynolds　number　of　770,　the　power　reaches　to　250　W,　which　is　equivalent　to　8.3　kW/cm3　volumetric　heat.　Compared　with　rectangular　micro-channels,　the　average　temperature　and　the　maximal　junction　temperature　of　the　heater　surface　with　in-line　micro-pin　fins　are　only　46.34,　13.96　K,　down　by　13.26,　21.34　K,　respectively.　©　2017,　Editorial　Department　of　Journal　of　Aerospace　Power.　All　right　reserved.

关键词：

Cooling Fins (heat exchange) Heat convection Heat flux Heat transfer performance Liquids Reynolds number Three dimensional integrated circuits Timing circuits

作者机构：

[ 1 ] [Ma, Dandan]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, School of Environmental and Energy Engineering, Beijing University of Technology, Beijing; 100124, China
[ 2 ] [Xia, Guodong]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, School of Environmental and Energy Engineering, Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Chen, Zhuo]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, School of Environmental and Energy Engineering, Beijing University of Technology, Beijing; 100124, China
[ 4 ] [Wang, Zhuo]Key Laboratory of Enhanced Heat Transfer and Energy Conservation, School of Environmental and Energy Engineering, Beijing University of Technology, Beijing; 100124, China

通讯作者信息：

夏国栋
[xia, guodong]key laboratory of enhanced heat transfer and energy conservation, school of environmental and energy engineering, beijing university of technology, beijing; 100124, china

电子邮件地址：

xgd@bjut.edu.cn

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