Using　infrared　thermal　imager　calibrated　the　epoxy　molding　compound　(EMC),　copper,　copper　joints　surface　emissivity　of　not　separated　QFN　package　within　40-200,　using　the　above　three　surface　calibrated　the　air　transmittance.　The　results　show　that　the　direct　calculation　method　and　direct　adjustment　method　can　be　well　applied　in　the　calibration　of　EMC,　direct　calculation　method　can　be　well　applied　in　the　calibration　of　copper　joints　and　copper　solder.　The　emissivity　calibration　results　of　EMC　is　in　0.97　or　so;　the　emissivity　calibration　results　of　copper　joints　with　a　linear　change　from　0.17　to　0.35　when　the　temperature　increased;　the　emissivity　calibration　value　of　copper　surface　increased　after　the　first　stabled.　The　air　transmittance　calibration　value　of　EMC　surface　and　copper　joints　were　around　100%,　fluctuated　less　than　2%.　The　experimental　results　could　provide　some　corresponding　parameters　for　infrared　termograph　during　the　process　measuring　QFN　using　temperature　and　cutting　separation　temperature.　©　2017,　Editorial　Board　of　Journal　of　Infrared　and　Laser　Engineering.　All　right　reserved.