This　work　concerns　the　fabrication　of　a　salt　based　form-stable　phase　change　composite　by　employing　halloysite　nanotube　(HNT)　as　ceramic　supporting　material　(CSM).　The　HNT　has　been　broadly　reported　for　preparation　of　low-temperature　organic　composites　but　very　little　has　been　done　in　medium　and　high　temperature　thermal　energy　storage　fields.　Herein　we　demonstrate　for　the　first　time　with　the　use　of　HNT　as　skeleton　substance　for　the　fabrication　of　salt　composite　by　cold　compression　and　hot　sintering　technology.　The　feasibility　of　material　fabrication　is　confirmed　by　evaluating　a　case　containing　a　salt　of　sodium　nitrate　as　phase　change　material　and　HNT　as　CSM.　The　effect　of　preheating　treatment　of　HNT　on　the　microstructure　and　phase　change　behaviours　as　well　as　cycling　performance　of　the　composite　is　investigated.　The　results　show　that　HNT　can　be　wetted　by　the　liquid　nitrate　salt　at　elevated　temperatures,　verifying　the　viability　of　the　present　strategy　by　using　HNT　as　SSM　for　the　synthesis　of　salt　composite.　A　stable　chemical　structure　is　achieved　in　the　salt-HNT　composite,　which　confirms　a　preeminent　chemical　stability　and　compatibility　between　the　HNT　and　nitrate　salt.　The　hollow　tubular　structure　of　HNT　could　not　only　be　able　to　provide　extra　surface　for　accommodating　liquid　salt　to　form　a　dense　composite,　but　also　strengthen　the　thermal　stability　of　the　nitrate　salt.　The　preheating　treatment　of　HNT　at　300　degrees　C　and　500　degrees　C　respectively　causes　the　occurrence　of　dehydration　and　dehydroxylation　process,　which　in　turn　leads　to　the　morphology　and　microstructure　change　of　HNT,　and　hence　affects　the　cycling　performance　of　the　composite.　In　comparison　with　the　composite　made　from　HNT　preheated　at　500　degrees　C　where　a　serious　pulverization　and　deformation　has　been　observed　after　100　thermal　cycles,　the　composite　containing　HNT　preheated　at　300　degrees　C　presents　more　stable　structure　and　excellent　cycling　performance,　revealing　that　the　HNT　is　only　suitable　for　the　accommodation　of　inorganic　salt　that　having　application　temperature　limit　less　than　500　degrees　C.