A　short　pulse　(6　ns)　laser　with　wavelength　of　532　nm　is　employed　to　mill　Y-TZP　ceramic.　The　relationship　between　power　and　groove　width　by　single-pass　machining　is　explored,　and　the　relationship　between　threshold　and　pulse　number　is　analyzed　to　make　sure　the　threshold　of　Y-TZP.　Also　the　variation　of　removal　rate　and　quality　with　different　parameters　is　analyzed　to　determine　the　optimal　process　parameters　further.　the　micron-sized　twodimension　structure　is　conducted　further.　The　results　show　that　the　square　of　groove　width　is　proportional　to　logarithmic　peak　pulse　laser　power,　and　the　calculated　laser　spot　radius　is　matched　with　measured　value.　The　material　threshold　decreases　with　the　increase　in　the　number　of　pulses.　The　removal　rate　is　up　to　the　maximum,　1.35　mm3/min,　in　the　optimum　combination　of　scanning　speed,　power　and　repetition　rate.　The　blind　hole　of　diameter　500　mm　and　steps　in　square　cavity　structure　of　width　200　mm　and　depth　100　mm　are　obtained　by　optimizing　laser　processing　parameters.　The　two-dimension　structures　are　no　crack　and　better　processing　quality　and　the　surface　roughness　Ra　is　3.746　mm.　©,　2015,　Science　Press.　All　right　reserved.