Warpage　and　stress　arising　from　the　assembly　process　of　a　TSV　interposer　have　important　impacts　on　the　reliability　of　microbumps.　In　this　paper,　two　assembly　processes,　the　top-down　process　and　the　bottom-up　process,　are　simulated　by　the　finite　element　method.　By　comparing　the　warpage　and　stress　induced　in　the　two　assembly　processes,　an　optimized　process　is　obtained.　The　mechanical　behavior　of　microbumps　during　each　step　of　the　optimized　process　is　investigated　by　focusing　on　the　effect　of　microbump　location　on　the　microbump　reliability.　The　results　show　that　the　TSV-copper　deformation　has　significant　impact　on　the　plastic　work　density　of　the　microbump,　the　microbumps　should　be　designed　to　keep　away　from　the　underfill　fillet.　In　the　case　of　the　microbump　located　right　up　on　the　TSV,　the　plastic　work　density　of　the　microbump　array　is　the　lowest　and　has　an　almost　uniform　distribution.　©,　2015,　Tsinghua　University.　All　right　reserved.