When　it　comes　to　electronics　packaging,　measuring　the　fracture　toughness　of　adhesive　materials　is　critical.　Our　research　involved　conducting　double　cantilever　beam　(DCB)　tests　to　study　the　behavior　of　sintered　silver　in　mode　I　fracture,　which　is　doped　with　different　weights　of　nickel-coated　multiwall　carbon　nanotube　additives.　The　results　showed　that　when　the　sintered　silver　DCB　adhesive　joints　contained　0.5　wt%　nanofiller,　their　mode　I　fracture　toughness　increased　to　0.0701　N/mm.　This　represents　an　89.97　%　improvement　over　the　fracture　toughness　of　sintered　silver　without　nanofiller　additives.　The　nickel-coated　multiwall　carbon　nanotube　nanofillers　influenced　both　the　microstructure　characteristics　and　the　propagation　path　of　cracks　in　sintered　silver.　We　used　an　inverse　method　to　present　cohesive　zone　models　of　sintered　silver　with　varying　nanofiller　contents.　The　representative　mode　I　resistance　curves　of　sintered　silver　with　different　contents　of　nanofiller　are　also　presented　and　discussed.　The　results　of　our　study　can　help　increase　the　reliability　and　strengthen　the　mode　I　fracture　resistance　for　the　sintered　silver　interconnection　bonding　layer　by　adding　an　appropriate　nanofiller.